Title:
SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/085016
Kind Code:
A1
Abstract:
Provided is a substrate treatment method including a step for developing a substrate wherein a negative-type metal-containing resist film is formed and subjected to an exposure treatment and a heat-treatment after the exposure treatment, said substrate being developed using a polar development material and a nonpolar development material.
Inventors:
DINH CONGQUE (JP)
NAGAHARA SEIJI (JP)
MURAMATSU MAKOTO (JP)
NAGAHARA SEIJI (JP)
MURAMATSU MAKOTO (JP)
Application Number:
PCT/JP2023/036703
Publication Date:
April 25, 2024
Filing Date:
October 10, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
G03F7/32; G03F7/004; G03F7/30; H01L21/027
Domestic Patent References:
| WO2018123388A1 | 2018-07-05 | |||
| WO2023048029A1 | 2023-03-30 |
Foreign References:
| JP2016530565A | 2016-09-29 | |||
| JP2022526031A | 2022-05-20 | |||
| JPS5020713A | 1975-03-05 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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