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Patent Searching and Data


Title:
SUBSTRATE TREATMENT SYSTEM AND SUBSTRATE TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2017/141495
Kind Code:
A1
Abstract:
Provided is a substrate treatment system that is equipped with: a plating device that has a first conveyance part for conveying a first substrate and carries out the first substrate using the first conveyance part after the surface of the first substrate is plated while in a stationary state; and a pre-stage device that has a second conveyance part for conveying a second substrate and, in tandem with the carrying out of the first substrate by the first conveyance part, conveys the second substrate, as a first substrate, to the plating device using the second conveyance part. The timing at which the second conveyance part conveys the second substrate to the plating device is controlled in accordance with the amount of plating time.

Inventors:
NISHIKIUCHI, Hisashi (Tenjinkita-machi 1-1, Teranouchi-agaru 4-chome, Horikawa-dori, Kamigyo-ku, Kyoto-sh, Kyoto 85, 〒6028585, JP)
Application Number:
JP2016/081538
Publication Date:
August 24, 2017
Filing Date:
October 25, 2016
Export Citation:
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Assignee:
SCREEN HOLDINGS CO., LTD. (Tenjinkita-machi 1-1, Teranouchi-agaru 4-chome Horikawa-dori, Kamigyo-ku, Kyoto-sh, Kyoto 85, 〒6028585, JP)
International Classes:
C25D19/00; B08B3/02; C25D5/02; C25D7/12; C25D17/00; C25D17/06
Domestic Patent References:
WO2001068952A12001-09-20
Foreign References:
JPH05320954A1993-12-07
JP2001089899A2001-04-03
JP2013089609A2013-05-13
JP2004140336A2004-05-13
Attorney, Agent or Firm:
FURIKADO, Shoichi et al. (4F TAKAGI BLDG, 1-19 Nishitenma 5-chome, Kita-ku, Osaka-sh, Osaka 47, 〒5300047, JP)
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