Title:
SUBSTRATE UNPACKING DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/159418
Kind Code:
A1
Abstract:
A substrate unpacking device. The substrate unpacking device comprises a connecting plate (20), a plurality of adsorption components (21) and multiple height detecting sensors (23). The adsorption components (21) are used for absorbing target objects, and the multiple height detecting sensors (23) are respectively arranged between the connecting plate (20) and the plurality of adsorption components (21). The substrate unpacking device can reduce the substrate fragment and protect the mechanism from damage.
Inventors:
QI MINGHU (CN)
WU CHUNHAO (CN)
LIN KUNHSIEN (CN)
WANG YONGQIANG (CN)
LI XIANDE (CN)
GUO ZHENHUA (CN)
WU CHUNHAO (CN)
LIN KUNHSIEN (CN)
WANG YONGQIANG (CN)
LI XIANDE (CN)
GUO ZHENHUA (CN)
Application Number:
PCT/CN2012/075981
Publication Date:
October 31, 2013
Filing Date:
May 24, 2012
Export Citation:
Assignee:
SHENZHEN CHINA STAR OPTOELECT (CN)
QI MINGHU (CN)
WU CHUNHAO (CN)
LIN KUNHSIEN (CN)
WANG YONGQIANG (CN)
LI XIANDE (CN)
GUO ZHENHUA (CN)
QI MINGHU (CN)
WU CHUNHAO (CN)
LIN KUNHSIEN (CN)
WANG YONGQIANG (CN)
LI XIANDE (CN)
GUO ZHENHUA (CN)
International Classes:
B65B69/00; B65H3/08
Foreign References:
| CN1882242A | 2006-12-20 | |||
| CN202072319U | 2011-12-14 | |||
| CN101941595A | 2011-01-12 | |||
| JP2003019684A | 2003-01-21 | |||
| JPH09252197A | 1997-09-22 | |||
| JPH09183525A | 1997-07-15 |
Attorney, Agent or Firm:
CHINA WISPRO INTELLECTUAL PROPERTY LLP. (CN)
深圳市威世博知识产权代理事务所（普通合伙） (CN)
深圳市威世博知识产权代理事务所（普通合伙） (CN)
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