Title:
SUBSTRATE WAFER PRODUCTION METHOD AND SUBSTRATE WAFER
Document Type and Number:
WIPO Patent Application WO/2021/235067
Kind Code:
A1
Abstract:
The present invention is a substrate wafer production method in which a substrate wafer is produced by preparing a wafer that has a first principal surface and a second principal surface, forming a flattened resin layer on the second principal surface, performing first processing that involves grinding or polishing the first principal surface while the flattened resin layer is suctioned and held as a reference surface, removing the flattened resin layer from the wafer, performing second processing that involves grinding or polishing the second principal surface while the post–first processing first principal surface is suctioned and held, performing third processing that involves further grinding or polishing the first principal surface while the post–second processing second principal surface is suctioned and held, and performing fourth processing that involves further grinding or polishing the second principal surface while the post–third processing first principal surface is suctioned and held. The first processing and/or the third processing is performed such that the thickness distribution of the wafer is indented in the middle or protrudes in the middle. The present invention can thereby provide a substrate wafer production method that makes it possible to produce a substrate wafer that has both curvature and a favorable nanotopography.
Inventors:
TAGA RYO (JP)
TANAKA YUKI (JP)
TANAKA YUKI (JP)
Application Number:
PCT/JP2021/010731
Publication Date:
November 25, 2021
Filing Date:
March 17, 2021
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B24B1/00; B24B7/04; B24B37/005; H01L21/304
Foreign References:
| JP2018074018A | 2018-05-10 | |||
| JP2011077508A | 2011-04-14 | |||
| JP2010034461A | 2010-02-12 | |||
| JP2015008247A | 2015-01-15 | |||
| JP2008140856A | 2008-06-19 | |||
| JP2017210396A | 2017-11-30 | |||
| JP2008140856A | 2008-06-19 | |||
| JP2017098446A | 2017-06-01 | |||
| JP2006269761A | 2006-10-05 | |||
| JP2009148866A | 2009-07-09 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
Download PDF: