Title:
SUBSTRATE WASHING METHOD AND SUBSTRATE WASHING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2010/131581
Kind Code:
A1
Abstract:
Provided is a substrate washing method in which the process time necessary to remove foreign matter on a substrate surface can be reduced and the surface can be prevented from being irregularly ground. The substrate washing method for washing a substrate (10) by grinding the same comprises a step of conveying a first substrate (10) and a second substrate, a step of grinding the first substrate (10) by a roller grinding stone (20), and a step of grinding the second substrate by the roller grinding stone (20). In the step of grinding the first substrate (10), the roller grinding stone (20) is slid in a direction (40) perpendicular to the conveyance direction (50) of the first substrate (10) and in the longitudinal direction of the roller grinding stone (20).
Inventors:
OKAJIMA, Shunsuke (())
Application Number:
JP2010/057582
Publication Date:
November 18, 2010
Filing Date:
April 28, 2010
Export Citation:
Assignee:
SHARP KABUSHIKI KAISHA (22-22, Nagaike-cho Abeno-ku, Osaka-sh, Osaka 22, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
International Classes:
G02F1/13; B08B1/04; B24B7/12; B24B7/26; G02F1/1333
Attorney, Agent or Firm:
TESHIMA Masaru (Teshima Patent Law Firm, 5F MF MinamiMorimachi Bldg. 2-3-8, Tenjinbashi, Kita-ku, Osaka-sh, Osaka 41, 〒5300041, JP)
Claims: