Title:
SUBSTRATE WITH ADHESION PROMOTING LAYER, METHOD FOR PRODUCING MOLD, AND METHOD FOR PRODUCING MASTER MOLD
Document Type and Number:
WIPO Patent Application WO/2011/155602
Kind Code:
A1
Abstract:
Disclosed is a substrate with an adhesion promoting layer, wherein an adhesion promoting layer is provided on a substrate and an organic compound layer is to be provided on the adhesion promoting layer. An adsorptive functional group and an adhesion promoting functional group are contained in each molecule of a compound that is contained in the adhesion promoting layer. The adsorptive functional group is composed of a modified silane group that mainly binds to the substrate, and the adhesion promoting functional group mainly promotes and improves adhesion to the organic compound layer.
Inventors:
SUZUKI Kota (C/O HOYA CORPORATION, 7-5 Nakaochiai 2-chome, Shinjuku-k, Tokyo 25, 〒1618525, JP)
Application Number:
JP2011/063382
Publication Date:
December 15, 2011
Filing Date:
June 10, 2011
Export Citation:
Assignee:
HOYA CORPORATION (7-5 Nakaochiai 2-chome, Shinjuku-ku Tokyo, 25, 〒1618525, JP)
ＨＯＹＡ株式会社 (〒25 東京都新宿区中落合二丁目７番５号 Tokyo, 〒1618525, JP)
ＨＯＹＡ株式会社 (〒25 東京都新宿区中落合二丁目７番５号 Tokyo, 〒1618525, JP)
International Classes:
B32B27/00; B29C33/38; B29C59/02
Attorney, Agent or Firm:
ANIYA Setuo et al. (21 TOWA BLDG. 3F, 6-1 Iidabashi 4-chome, Chiyoda-k, Tokyo 72, 〒1020072, JP)
Claims:
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