Title:
SUBSTRATE WITH BUILT-IN DIRECTIONAL COUPLER, HIGH-FREQUENCY FRONT-END CIRCUIT, AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/079614
Kind Code:
A1
Abstract:
A substrate (10) with a built-in coupler according to the present invention is provided with: a coupler (11) having a main line (111) and an auxiliary line (112); a capacitor (C11) connected in parallel to the auxiliary line (112); a capacitor (C12) connecting the other end (112b) of the auxiliary line (112) to a ground; a resistor element (R12) connecting the other end (112b) of the auxiliary line (112) to the ground, and having impedance lower than a standardized impedance at a prescribed frequency; a matching circuit (M1) that is connected between one end (112a) of the auxiliary line (112) and a coupling port (PCPL), and matches the impedance of the coupling port (PCPL) with the standardized impedance at the prescribed frequency; and a multilayer substrate (12) that is constituted by laminating a plurality of substrate layers (121a), and in which the coupler (11) is built in.
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Inventors:
HANAOKA KUNITOSHI (JP)
Application Number:
PCT/JP2017/038538
Publication Date:
May 03, 2018
Filing Date:
October 25, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01P5/18
Domestic Patent References:
| WO2011074370A1 | 2011-06-23 | |||
| WO2016121455A1 | 2016-08-04 |
Foreign References:
| JP2012105193A | 2012-05-31 | |||
| JP2011250354A | 2011-12-08 | |||
| JP2013046305A | 2013-03-04 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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