Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SUBSTRATE WITH FILM FORMED THEREON
Document Type and Number:
WIPO Patent Application WO/2023/033146
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a novel substrate with a film formed thereon, in which a high-density film is formed on at least a part of a metal surface present on a substrate. Provided is a substrate with a film formed thereon, wherein a film which contains a compound having a structural unit derived from a monomer and an adsorption group is formed on at least a part of a metal surface present on a substrate, and the specific gravity of the metal is not more than 19.30 g/cm3.

Inventors:
HARIGAE TAKAKO (JP)
MIZUSHIMA CHIHO (JP)
SHINOKURA TOMONORI (JP)
Application Number:
PCT/JP2022/033133
Publication Date:
March 09, 2023
Filing Date:
September 02, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NIPPON CATALYTIC CHEM IND (JP)
International Classes:
B32B15/08; C08F2/00; C08F20/10; C08F220/10; C08F292/00; C09D133/04; C09D201/02; C09K3/18; H01L21/312
Domestic Patent References:
WO2018235877A12018-12-27
WO2015056611A12015-04-23
Other References:
IKEDA TAKUYA, TAKATA TOMOKI, TAKAGI JURI, ADACHI KAORU, TSUKAHARA YASUHISA: "Enhancement of Oxidation Resistance of Copper by an Organic Thin Layer and its Influence on Electrical Conductivity", JAPANESE JOURNAL OF POLYMER SCIENCE AND TECHNOLOGY, SOCIETY OF POLYMER SCIENCE JP, JP, vol. 73, no. 2, 1 January 2016 (2016-01-01), JP , pages 198 - 206, XP093042914, ISSN: 0386-2186, DOI: 10.1295/koron.2015-0071
TAKAGI JURI, IKEDA TAKUYA, ADACHI KAORU, TSUKAHARA YASUHISA: "Study on Oxidation Resistance of Copper Plate with Organic Thin Layer by Cyclic Voltammetry", JAPANESE JOURNAL OF POLYMER SCIENCE AND TECHNOLOGY, SOCIETY OF POLYMER SCIENCE JP, JP, vol. 73, no. 3, 1 January 2016 (2016-01-01), JP , pages 294 - 301, XP093042919, ISSN: 0386-2186, DOI: 10.1295/koron.2015-0081
RENXU CHEN, ET AL.: "Grafting Acrylic Polymers from Flat Nickel and Copper Surfaces by Surface-Initiated Atom Transfer Radical Polymerization", LANGMUIR, AMERICAN CHEMICAL SOCIETY, US, vol. 24, no. 13, 29 May 2008 (2008-05-29), US , pages 6889 - 6896, XP055685920, ISSN: 0743-7463, DOI: 10.1021/la800171h
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
Download PDF: