Title:
SUBSTRATE WITH MASK AND METHOD FOR PRODUCING SUBSTRATE WITH RECESSED AND PROJECTED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/163510
Kind Code:
A1
Abstract:
This method for producing a substrate with a recessed and projected structure comprises: a first mask formation step for forming a first mask 21, which comprises a single particle film F configured from a plurality of particles P, on a substrate 11; a second mask formation step for forming a second mask 22 on the substrate 11 by curing a liquid body that contains a mask material; and an etching step for etching the substrate 11 with use of the first mask 21 and the second mask 22.
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Inventors:
KAJITA YASUHITO (JP)
HIRAMA SATORU (JP)
DAI KOTARO (JP)
SHINOTSUKA KEI (JP)
HIRAMA SATORU (JP)
DAI KOTARO (JP)
SHINOTSUKA KEI (JP)
Application Number:
PCT/JP2016/061508
Publication Date:
October 13, 2016
Filing Date:
April 08, 2016
Export Citation:
Assignee:
OJI HOLDINGS CORP (JP)
International Classes:
H01L21/3065; H01L33/22
Domestic Patent References:
| WO2010032543A1 | 2010-03-25 |
Foreign References:
| JP2014170601A | 2014-09-18 | |||
| JP2009130027A | 2009-06-11 |
Attorney, Agent or Firm:
ONDA, Makoto et al. (JP)
Makoto Onda (JP)
Makoto Onda (JP)
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