Title:
SUBSTRATE WORK MACHINE
Document Type and Number:
WIPO Patent Application WO/2022/054191
Kind Code:
A1
Abstract:
This substrate work machine is provided with: a support member that supports a substrate from the bottom surface thereof; a clamp device that clamps the substrate in a state of being supported by the support member; a lifting device that lifts and lowers the support member along with the clamp device; a contact body that comes into contact with the support member or the substrate supported on the support member as a result of the contact body being positioned at a prescribed height above the support member and the support member being lifted by the lifting device; and a computation device that computes the thickness of the substrate supported on the support member on the basis of the difference between the height of the support member when the support member comes into contact with the contact body, and the height of the support member when the substrate supported on the support member comes into contact with the contact body.
Inventors:
TORII ATSUSHI (JP)
Application Number:
PCT/JP2020/034253
Publication Date:
March 17, 2022
Filing Date:
September 10, 2020
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
B41F15/18; G01B5/06; H05K3/34
Foreign References:
| JP2012066558A | 2012-04-05 | |||
| JP2012145439A | 2012-08-02 | |||
| JPH0666549A | 1994-03-08 |
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
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