Title:
SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2024/004263
Kind Code:
A1
Abstract:
Provided is a substrate 100 comprising: a core substrate 10 having a first surface 11 and a second surface 12 of a side opposite the first surface 11, and provided internally with an opening 13; at least a plurality of electronic components 20 provided in the opening 13; and a sealing material 30 containing a resin 33 and a filler 34 and provided between the opening 13 and the plurality of electronic components 20, and between the plurality of electronic components 20. An average of intervals S1 between the plurality of electronic components 20 is less than a shortest distance S2 between a wall surface 13a of the opening 13 and the electronic components 20 adjacent to the wall surface 13a.
Inventors:
KUBO RYUICHI (JP)
Application Number:
PCT/JP2023/005690
Publication Date:
January 04, 2024
Filing Date:
February 17, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46
Domestic Patent References:
| WO2006011508A1 | 2006-02-02 |
Foreign References:
| JP2019207978A | 2019-12-05 | |||
| JP2004349672A | 2004-12-09 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
Download PDF:
Previous Patent: SUBSTRATE
Next Patent: RECOVERY PLAN CREATION ASSISTANCE SYSTEM AND RECOVERY PLAN CREATION ASSISTANCE METHOD
Next Patent: RECOVERY PLAN CREATION ASSISTANCE SYSTEM AND RECOVERY PLAN CREATION ASSISTANCE METHOD