Title:
SUCTION APPARATUS, POLISHING APPARATUS, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2006/103854
Kind Code:
A1
Abstract:
A suction apparatus (1) holds a wafer (W) by sucking the wafer (W) by vacuum. The suction apparatus (1) is provided with a suction base material (2). The suction base material (2) is provided with a plurality of pin-shaped protruding sections (2a) formed to have leading end planes (upper planes) at a same level, and has rigidity. The leading end planes of the protruding sections (2a) are coated with a coating layer having elasticity through a base layer (4). Even when a foreign material exists between the wafer (W) and a suction plane when the wafer (W) is sucked, the foreign material is buried in the coating layer (3), and planarity of the wafer (W) is improved. Furthermore, since the coating layer (3) can be made relatively thin, swelling of the wafer (W) can be reduced, and the planarity of the wafer (W) being sucked can be improved also from this point of view.
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Inventors:
ASADA NAOKI (JP)
Application Number:
PCT/JP2006/303360
Publication Date:
October 05, 2006
Filing Date:
February 17, 2006
Export Citation:
Assignee:
NIKON CORP (JP)
ASADA NAOKI (JP)
ASADA NAOKI (JP)
International Classes:
B24B37/30; B23Q3/08; B24B41/06; H01L21/304; H01L21/683
Foreign References:
| JP2004259792A | 2004-09-16 | |||
| JPH0691463A | 1994-04-05 | |||
| JPS6373625A | 1988-04-04 | |||
| JPH10229115A | 1998-08-25 |
Attorney, Agent or Firm:
Ohnishi, Shogo (Higashi-Ikebukuro SS Building 1F 3-20-3, Higashi-Ikebukur, Toshima-ku Tokyo, JP)
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