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Title:
SUCTION-ATTACHMENT STAGE
Document Type and Number:
WIPO Patent Application WO/2019/065355
Kind Code:
A1
Abstract:
This suction-attachment stage (20) comprises: an upper plate (21) having a plurality of suction-attachment holes (22); first to third vacuum flow passageways(41 to 43) which respectively connect the plurality of suction-attachment holes (22) in the upper plate (21) to a vacuum device (45) for a plurality of groups A1 to A3 corresponding to the size of a semiconductor die; and first and second check valves (61, 62) respectively disposed in the second and third vacuum flow passageways (42, 43). The first and second check valves (61, 62) close when the suction-attachment holes (22) are opened to the atmosphere, and open when the suction-attachment holes (22) are blocked by a semiconductor die.

Inventors:
KOBAYASHI TAITO (JP)
MAZUME KUNIHIKO (JP)
Application Number:
PCT/JP2018/034388
Publication Date:
April 04, 2019
Filing Date:
September 18, 2018
Export Citation:
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Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/683; H01L21/52; H01L21/60
Foreign References:
JPH0490946U1992-08-07
JP2009212254A2009-09-17
JP2009200377A2009-09-03
JP2013179207A2013-09-09
JPH081464A1996-01-09
JPS618250A1986-01-14
Attorney, Agent or Firm:
YKI INTELLECTUAL PROPERTY ATTORNEYS (JP)
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