Title:
SUCTION DEVICE AND VACUUM PROCESS DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/002141
Kind Code:
A1
Abstract:
In this suction device for cooling a substrate using a cooling gas, there is provided a technique for improving the cooling efficiency of the substrate by preventing a leak of the cooling gas. In the present invention, in a state in which a substrate 10 is not supported, raising and lowering members 15 are configured so that connection sections 15a are each disposed inside a guide section 53 of a guide through-hole 52, and substrate support sections 15b are each disposed inside an accommodation section 54 of the guide through-hole 52. O-rings 17 are provided between the connection sections 15a and the substrate support sections 15b of the raising and lowering members 15, the O-rings each sealing the accommodation section 54 of the guide through-hole 52 with respect to the guide section 53 by bringing the connection section 15a of each raising and lowering member 15 into close contact with a support wall section 55 provided to the accommodation section 54 of the guide through-hole 52, and supporting the connection section.
Inventors:
SAKAUE HIROTOSHI (JP)
OONO TETSUHIRO (JP)
OONO TETSUHIRO (JP)
Application Number:
PCT/JP2020/022121
Publication Date:
January 07, 2021
Filing Date:
June 04, 2020
Export Citation:
Assignee:
ULVAC INC (JP)
International Classes:
H01L21/3065; C23C14/50; C23C16/458; H01L21/683
Domestic Patent References:
WO2013054776A1 | 2013-04-18 |
Foreign References:
JP2010021405A | 2010-01-28 | |||
JPH0432230A | 1992-02-04 | |||
JP2008187102A | 2008-08-14 | |||
JPH06349750A | 1994-12-22 |
Attorney, Agent or Firm:
OMORI, Junichi (JP)
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