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Title:
SUPERCONDUCTOR ASSEMBLY
Document Type and Number:
WIPO Patent Application WO2002082559
Kind Code:
A3
Abstract:
The invention relates to a superconductor assembly comprising a metallic superconductor (MSL) and a ceramic superconductor (HTS), which are mechanically and electrically interconnected, preferably by means of a solder connection (LV) consisting of low-melting solder, to form a one-piece hybrid superconductor.

Inventors:
ARNDT THOMAS J (DE)
FISCHER BERNHARD (DE)
MUNZ MARTIN (DE)
SZULCZYK ANDREAS (DE)
THOENER MANFRED (DE)
Application Number:
PCT/EP2002/003031
Publication Date:
October 30, 2003
Filing Date:
March 19, 2002
Export Citation:
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Assignee:
VACUUMSCHMELZE GMBH & CO KG (DE)
ARNDT THOMAS J (DE)
FISCHER BERNHARD (DE)
MUNZ MARTIN (DE)
SZULCZYK ANDREAS (DE)
THOENER MANFRED (DE)
International Classes:
H01F6/06; H01L39/14; (IPC1-7): H01L39/14
Other References:
ONISHI T ET AL: "Improvement of stabilized current density in superconducting composite conductor", ADVANCES IN SUPERCONDUCTIVITY XI. PROCEEDINGS OF THE 11TH INTERNATIONAL SYMPOSIUM ON SUPERCONDUCTIVITY (ISS'98), FUKUOKA, JAPAN, 16 November 1998 (1998-11-16) - 19 November 1998 (1998-11-19), Springer-Verlag, Japan, pages 1381 - 1384 vol.2, XP001121175, ISBN: 4-431-70256-3
APPERLEY M H ET AL: "Properties of Ag-Mg alloy sheathed Bi-2223 tapes", CRYOGENICS, vol. 40, no. 4-5, April 2000 (2000-04-01), pages 319 - 324, XP004218757, ISSN: 0011-2275
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 03 28 April 1995 (1995-04-28)
PATENT ABSTRACTS OF JAPAN vol. 018, no. 681 (E - 1649) 21 December 1994 (1994-12-21)
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