Title:
SUPERCONDUCTOR GROUND PLANE PATTERNING GEOMETRIES THAT ATTRACT MAGNETIC FLUX
Document Type and Number:
WIPO Patent Application WO/2020/180445
Kind Code:
A3
Abstract:
Superconducting integrated circuit (100) layouts are proofed against the detrimental effects of stray flux by designing and fabricating them to have one or more ground planes (104) patterned in thex y plane with a regular grid (106) of low-aspect-ratio flux-trapping voids (202). The ground plane(s) can be globally patterned with such voids and thousands or more superconducting circuit devices and wires can thereafter be laid out so as not to intersect or come so close to the voids that the trapped flux would induce supercurrents in them, thus preventing undesirable coupling of flux into circuit elements. Sandwiching a wire layer between patterned ground planes permits wires to be laid out even closer to the voids. Voids of successively smaller maximum dimension can be concentrically stacked in pyramidal fashion in multiple ground plane layers having different superconductor transition temperatures, increasing the x-y area available for device placement and wire-up.
Inventors:
HERR ANNA Y (US)
TALANOV VLADIMIR V (US)
HERR QUENTIN P (US)
TALANOV VLADIMIR V (US)
HERR QUENTIN P (US)
Application Number:
PCT/US2020/016798
Publication Date:
December 03, 2020
Filing Date:
February 05, 2020
Export Citation:
Assignee:
NORTHROP GRUMMAN SYSTEMS CORP (US)
International Classes:
H01L39/14; H01L27/18; H01L39/24
Foreign References:
| JP2004072023A | 2004-03-04 | |||
| JPH10200171A | 1998-07-31 | |||
| JP2006066783A | 2006-03-09 |
Attorney, Agent or Firm:
HARRIS, Christopher P. (US)
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