Title:
SUPERCRITICAL FLUID-BASED CLEANING COMPOSITIONS AND METHODS
Document Type and Number:
WIPO Patent Application WO2004102621
Kind Code:
A3
Abstract:
Compositions and methods employing supercritical fluids, e.g., supercritical carbon dioxide, for removal of unwanted material from microelectronic device structures and process equipment. One composition of such type, having utility for removing flux and solder perform surface films, includes supercritical fluid, e.g., supercritical CO2, and organic co-solvent, e.g., xylene. Another composition of such type having utility for removal of metals, metal oxides, metal-containing post-etch residues and CMP particles from semiconductor substrates includes supercritical fluid and at least one ß-diketone.
Inventors:
ROEDER JEFFREY F (US)
BAUM THOMAS H (US)
HEALY MATTHEW (US)
XU CHONGYING (US)
BAUM THOMAS H (US)
HEALY MATTHEW (US)
XU CHONGYING (US)
Application Number:
PCT/US2004/013750
Publication Date:
August 31, 2006
Filing Date:
May 04, 2004
Export Citation:
Assignee:
ADVANCED TECH MATERIALS (US)
ROEDER JEFFREY F (US)
BAUM THOMAS H (US)
HEALY MATTHEW (US)
XU CHONGYING (US)
ROEDER JEFFREY F (US)
BAUM THOMAS H (US)
HEALY MATTHEW (US)
XU CHONGYING (US)
International Classes:
B08B3/00; B08B3/04; C11D1/00; C11D3/02; C11D3/16; C11D3/18; C11D3/20; C11D3/24; C11D3/28; C11D3/43; C11D7/02; C11D7/24; C11D7/26; C11D7/28; C11D7/50; C11D11/00; D06L1/00; G03F7/42; C11D7/32
Foreign References:
| US20020112746A1 | 2002-08-22 | |||
| US6309425B1 | 2001-10-30 |
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