Title:
SUPPORT BOARD FOR PERFORATION PROCESSING AND METHOD OF PERFORATION PROCESSING
Document Type and Number:
WIPO Patent Application WO/2008/044711
Kind Code:
A1
Abstract:
Support board for perforation processing (1) having lubrication layer (3) superimposed
on at least one surface of aluminum substratum (2), characterized in that the
lubrication layer (3) consists of a mixed composition containing a crystalline
water-soluble resin and a crystal nucleating agent. By this structuring, there
can be provided a support board for perforation processing with a lubrication
layer that excels in adherence to aluminum-made substratum, being free from
stickiness and that excels in blocking prevention performance, ensuring easy
washing after processing.
Inventors:
KABURAGI SHINGO (JP)
UDA YOSHIKAZU (JP)
OKURA KOJI (JP)
URAKI YASUYUKI (JP)
MIZO TATSUHIRO (JP)
UDA YOSHIKAZU (JP)
OKURA KOJI (JP)
URAKI YASUYUKI (JP)
MIZO TATSUHIRO (JP)
Application Number:
PCT/JP2007/069773
Publication Date:
April 17, 2008
Filing Date:
October 10, 2007
Export Citation:
Assignee:
OHTOMO CHEMICAL INS CORP (JP)
SHOWA DENKO PACKAGING CO (JP)
SHOWA DENKO KK (JP)
KABURAGI SHINGO (JP)
UDA YOSHIKAZU (JP)
OKURA KOJI (JP)
URAKI YASUYUKI (JP)
MIZO TATSUHIRO (JP)
SHOWA DENKO PACKAGING CO (JP)
SHOWA DENKO KK (JP)
KABURAGI SHINGO (JP)
UDA YOSHIKAZU (JP)
OKURA KOJI (JP)
URAKI YASUYUKI (JP)
MIZO TATSUHIRO (JP)
International Classes:
H05K3/00; B26F1/16
Foreign References:
| JP2000218599A | 2000-08-08 | |||
| JP2001146600A | 2001-05-29 | |||
| JP2006181657A | 2006-07-13 | |||
| JP2003225892A | 2003-08-12 | |||
| JP2003175412A | 2003-06-24 | |||
| JP2006181656A | 2006-07-13 |
Attorney, Agent or Firm:
SHIMIZU, Hisayoshi et al. (4-26 Minamisemba 3-chome, Chuo-k, Osaka-shi Osaka 81, JP)
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