Title:
SUPPORT GLASS FOR SEMICONDUCTOR PACKAGES
Document Type and Number:
WIPO Patent Application WO/2019/021911
Kind Code:
A1
Abstract:
According to one aspect of the present invention, a support glass for semiconductor packages is provided which is less likely to be broken or is less likely to fly into pieces when broken. According to one aspect of the present invention, a support glass for semiconductor packages which has a specific elastic modulus of 30 MNm/kg or more and an average thermal expansion coefficient α of 55 to 80 × 10-7/°C at 50 to 350°C, and/or a support glass in which the X value defined in the description is 30000 or more is provided.
Inventors:
MURAYAMA SUGURU (JP)
OHARA SEIKI (JP)
LI QING (JP)
AKIBA SHUSAKU (JP)
ONO KAZUTAKA (JP)
OHARA SEIKI (JP)
LI QING (JP)
AKIBA SHUSAKU (JP)
ONO KAZUTAKA (JP)
Application Number:
PCT/JP2018/026966
Publication Date:
January 31, 2019
Filing Date:
July 18, 2018
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
C03C3/085; C03C3/087; C03C3/091; C03C3/093; C03C3/097; H01L21/56; H01L21/67
Domestic Patent References:
| WO2016190303A1 | 2016-12-01 | |||
| WO2015156075A1 | 2015-10-15 | |||
| WO2015076208A1 | 2015-05-28 |
Foreign References:
| JP2012232882A | 2012-11-29 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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