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Title:
SUPPORT FOR MANUFACTURING SEMICONDUCTOR PACKAGES, USE OF SUPPORT FOR MANUFACTURING SEMICONDUCTOR PACKAGES, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGES
Document Type and Number:
WIPO Patent Application WO/2018/003565
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a support for manufacturing semiconductor packages which exhibits superior durability in various processes such as polishing, heating, exposure/development, plating, and vacuum processing; use of said support for manufacturing semiconductor packages; and a method for manufacturing semiconductor packages. This support for manufacturing semiconductor packages has a base layer and an adhesive layer adjacent to the base layer, wherein the base layer is formed from a resin film containing an alicyclic structure.

Inventors:
HAZEYAMA Ichiro (6-2 Marunouchi 1-chom, Chiyoda-ku Tokyo 46, 〒1008246, JP)
Application Number:
JP2017/022504
Publication Date:
January 04, 2018
Filing Date:
June 19, 2017
Export Citation:
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Assignee:
ZEON CORPORATION (6-2 Marunouchi 1-chome, Chiyoda-ku Tokyo, 46, 〒1008246, JP)
International Classes:
H01L21/56; C09J201/00; H01L21/301; H01L21/52; H01L23/12
Domestic Patent References:
WO2013175987A12013-11-28
Foreign References:
JP2010083939A2010-04-15
JP2013168541A2013-08-29
JP2012104757A2012-05-31
JP2001332647A2001-11-30
JP2003291156A2003-10-14
Attorney, Agent or Firm:
SUGIMURA Kenji (36F Kasumigaseki Common Gate West, 3-2-1 Kasumigasek, Chiyoda-ku Tokyo 13, 〒1000013, JP)
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