Title:
SUPPORT PLATE, METHOD OF DETACHING WAFER, AND METHOD OF THINNING WAFER
Document Type and Number:
WIPO Patent Application WO/2008/015771
Kind Code:
A1
Abstract:
Hole (10) having nonthrough portion (10-3) is provided in an area of wafer adhesion of
a support plate capable of facial support through wafer adhesion by means of an
adhesive member so as to suppress dimpling of the wafer.
Inventors:
MIYANARI, Atsushi (150, Nakamaruko, Nakahara-ku, Kawasaki-sh, Kanagawa 12, 2110012, JP)
Application Number:
JP2007/000615
Publication Date:
February 07, 2008
Filing Date:
June 08, 2007
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO., LTD. (150 Nakamaruko, Nakahara-ku kawasaki-sh, Kanagawa 12, 2110012, JP)
東京応化工業株式会社 (〒12 神奈川県川崎市中原区中丸子１５０番地 Kanagawa, 2110012, JP)
東京応化工業株式会社 (〒12 神奈川県川崎市中原区中丸子１５０番地 Kanagawa, 2110012, JP)
International Classes:
H01L21/683; B24B37/00; B24B41/06; H01L21/304
Attorney, Agent or Firm:
OSUGA, Yoshiyuki (3rd Fl, Nibancho Bldg.8-20, Nibanch, Chiyoda-ku Tokyo 84, 1020084, JP)