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Title:
SUPPORT SUBSTRATE, LAMINATE WITH SUPPORT SUBSTRATE, AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2018/026004
Kind Code:
A1
Abstract:
A method for manufacturing a package substrate for mounting a semiconductor element, including: a first laminate readying step for readying a first laminate having a resin layer, an adhesive layer provided on at least the side of one surface of the resin layer and provided with a peeling means, and a first metal layer provided on the adhesive layer; a first wiring formation step for etching the first metal layer and forming a first wiring conductor on the first laminate; a second laminate formation step for laminating an insulating resin layer and a second metal layer in the sequence listed on the surface of the first laminate on which the first wiring conductor is provided, and forming a second laminate; a second wiring formation step for forming, in the insulating resin layer, a non-penetrating hole reaching the first wiring conductor, performing electroplating and/or electroless plating on the insulating resin layer in which the non-penetrating hole is formed, and forming a second wiring conductor on the insulating resin layer; and a peeling step for peeling at least the resin layer from the second laminate on which the second wiring conductor is formed.

Inventors:
HIRANO, Syunsuke (Inc. 446-3, Hachimanpara 3-chome, Yonezawa-sh, Yamagata 28, 〒9921128, JP)
KATO, Yoshihiro (Inc. 446-3, Hachimanpara 3-chome, Yonezawa-sh, Yamagata 28, 〒9921128, JP)
OGASHIWA, Takaaki (Inc. 446-3, Hachimanpara 3-chome, Yonezawa-sh, Yamagata 28, 〒9921128, JP)
KAWASHITA, Kazuaki (Inc. 446-3, Hachimanpara 3-chome, Yonezawa-sh, Yamagata 28, 〒9921128, JP)
NAKAJIMA, Youichi (Inc. 446-3, Hachimanpara 3-chome, Yonezawa-sh, Yamagata 28, 〒9921128, JP)
Application Number:
JP2017/028432
Publication Date:
February 08, 2018
Filing Date:
August 04, 2017
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL COMPANY, INC. (5-2 Marunouchi 2-chome, Chiyoda-ku Tokyo, 24, 〒1008324, JP)
International Classes:
H01L23/12; H05K3/46
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (TMI ASSOCIATES, 23rd Floor Roppongi Hills Mori Tower, 6-10-1, Roppongi, Minato-k, Tokyo 23, 〒1066123, JP)
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