Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SUPPORT SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/221379
Kind Code:
A1
Abstract:
The support substrate according to the present disclosure is a plate-shaped ceramic body having a first surface and a second surface that is located on the reverse side of the first surface. The arithmetic surface roughness Ra of the first surface, as obtained from a roughness curve, is no greater than 0.5 μm and the skewness Rsk, obtained from the roughness curve, is negative.

More Like This:
JP2020047836SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
JPS6018321TRANSFER MOLDING METHOD
JP2548004[Title of Invention] Liquid fixed quantity discharge device
Inventors:
HIGASHI KOUJI (JP)
Application Number:
PCT/JP2018/020033
Publication Date:
December 06, 2018
Filing Date:
May 24, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L21/56
Domestic Patent References:
WO2013008651A12013-01-17
Foreign References:
JP2008180685A2008-08-07
JP2010076948A2010-04-08
JP2016004915A2016-01-12
US20060183269A12006-08-17
Other References:
See also references of EP 3633714A4
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: POLYAMIDE RESIN COMPOSITION AND RELEASE FILM USING SAME

Next Patent: HOLDING MECHANISM