Title:
SUPPORTING METHOD AND SUPPORTING STRUCTURE OF REACTOR
Document Type and Number:
WIPO Patent Application WO/2010/034178
Kind Code:
A1
Abstract:
A supporting method and a supporting structure for increasing the contacting area of the bottom plate of a reactor body and a base flatform. The method comprises the step of filling binder into the space between the bottom plate of the reactor body and the base flatform, so a bonding layer is formed therebetween. The contacting area of the bottom plate of the reactor body and the base flatform is increased because the upper surface of the bonding layer is bonded with the bottom plate of the reactor body and the lower surface of the bonding layer is bonded with the base flatform, thereby the vibration of the bottom plate of the reactor body is damped.
Inventors:
TIAN, Qiang (Baishazhou, Hengyang, Hunan 7, 421007, CN)
田强 (中国湖南省衡阳市白沙洲, Hunan 7, 421007, CN)
田强 (中国湖南省衡阳市白沙洲, Hunan 7, 421007, CN)
Application Number:
CN2009/000635
Publication Date:
April 01, 2010
Filing Date:
June 09, 2009
Export Citation:
Assignee:
TBEA HENGYANG TRANSFORMERS CO., LTD. (Baishazhou, Hengyang, Hunan 7, 421007, CN)
特变电工衡阳变压器有限公司 (中国湖南省衡阳市白沙洲, Hunan 7, 421007, CN)
TIAN, Qiang (Baishazhou, Hengyang, Hunan 7, 421007, CN)
特变电工衡阳变压器有限公司 (中国湖南省衡阳市白沙洲, Hunan 7, 421007, CN)
TIAN, Qiang (Baishazhou, Hengyang, Hunan 7, 421007, CN)
International Classes:
H01F27/06
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS (LUO Jianmin, Room 718 Beijing Capital Times Square, 88 Xichang'an Avenue, Xicheng District, Beijing 1, 100031, CN)
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