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Title:
SUPPORTING PAD
Document Type and Number:
WIPO Patent Application WO/2011/027411
Kind Code:
A1
Abstract:
A supporting pad is provided which has a supporting face with heightened flatness precision and can improve the in-plane evenness of an object to be polished.  The supporting pad (10) includes a urethane sheet (2) formed by the wet solidification method and having a supporting face (Sh).  The urethane sheet (2) has a skin layer (2a) formed therein and has many cells (4) formed on the inner side of the skin layer (2a).  The cells (4) have such a size that the cells (4) extend over almost the whole thickness of the urethane sheet (2).  The cells (4) each has been formed so that the diameter thereof in a lower layer (Pr) of the urethane sheet (2) is larger than the diameter thereof in an upper layer (Ph) of the sheet (2).  The cells (4) have been formed so that the direction of cell formation in the upper layer (Ph) is evenly inclined in a certain direction relative to the thickness direction and that the direction of cell formation in the lower layer (Pr) is the same as the thickness direction.  When the pad (10) is compressed in polishing, a stress is evenly imposed on the object being polished.

Inventors:
KAWAMURA YOSHIHIDE (JP)
KUME TAKAHIRO (JP)
SATO AYAKO (JP)
Application Number:
PCT/JP2009/004791
Publication Date:
March 10, 2011
Filing Date:
September 24, 2009
Export Citation:
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Assignee:
FUJIBO HOLDINGS INC (JP)
KAWAMURA YOSHIHIDE (JP)
KUME TAKAHIRO (JP)
SATO AYAKO (JP)
International Classes:
B24B37/30; B24B41/06; H01L21/304
Domestic Patent References:
WO2004058450A12004-07-15
Foreign References:
JP2007160474A2007-06-28
JPH11277407A1999-10-12
JP2004358588A2004-12-24
Attorney, Agent or Firm:
IGARASHI, TOSHIAKI (JP)
Toshiaki Igarashi (JP)
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