Title:
SURFACE ACOUSTIC WAVE DEVICE, HIGH FREQUENCY FRONT-END CIRCUIT USING SURFACE ACOUSTIC WAVE DEVICE, AND COMMUNICATION DEVICE USING SURFACE ACOUSTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/198508
Kind Code:
A1
Abstract:
A surface acoustic wave device (20) relating to the present invention is provided with: a package substrate (60); a surface acoustic wave chip (210) that is provided with a chip substrate (211), i.e., a lithium niobate substrate; a surface acoustic wave chip (220) that is provided with a chip substrate (221), i.e., a lithium tantalate substrate; a bump (41) bonded to the surface acoustic wave chip (210); and a bump (42) bonded to the surface acoustic wave chip (220). The surface acoustic wave chip (210) is mounted on the package substrate (60) using the bump (41), and the surface acoustic wave chip (220) is mounted on the package substrate (60) using the bump (42). At this time, the material of the bump (41) has a Young's modulus that is lower than that of the material of the bump (42).
Inventors:
SHIN YASUAKI (JP)
Application Number:
PCT/JP2018/006569
Publication Date:
November 01, 2018
Filing Date:
February 22, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H03H9/72
Domestic Patent References:
| WO2017033575A1 | 2017-03-02 | |||
| WO2016208677A1 | 2016-12-29 |
Foreign References:
| JP2004007372A | 2004-01-08 | |||
| JP2013031030A | 2013-02-07 | |||
| JP2000295069A | 2000-10-20 | |||
| JP2016208056A | 2016-12-08 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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