SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURE THEREOF

Title:

SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURE THEREOF

Document Type and Number:

WIPO Patent Application WO/2000/046920

Kind Code:

A1

Abstract:

A SAW element (13) is formed of a piezoelectric substrate (14), on which are provided IDT electrodes (15), connection electrodes (16), underlying metal layers (17), and acoustic materials (18) placed on the underlying metal layers (17) and having surfaces parallel to the main surface of the piezoelectric substrate (14). The SAW element is mounted in a package (10), which is provided with external terminals (11) connected with the connection electrodes (16), and the package is hermetically sealed with a lid (20) to form a SAW device. When such a SAW element (13) is mounted faceup in a package (10) using a vacuum chuck (30), its piezoelectric substrate (14) can be protected against damage. When a SAW element (13) provided with bumps (23) on its connection electrodes (16) is mounted facedown in a package (10), the failure of electrical connections can be prevented.

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JPS60140917	SURFACE ACOUSTIC WAVE TRANSDUCER
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JPH0421793	FORMATION OF GROOVE ON LITHIUM-BASED SUBSTRATE

Inventors:

TSUZUKI SHIGERU (JP)
FUJII KUNIHIRO (JP)
TAKADA MASAHIRO (JP)
MATSUO SATOSHI (JP)
KOGA TAKAFUMI (JP)
MURAKAMI KOZO (JP)

Application Number:

PCT/JP2000/000638

Publication Date:

August 10, 2000

Filing Date:

February 07, 2000

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC IND CO LTD (JP)
TSUZUKI SHIGERU (JP)
FUJII KUNIHIRO (JP)
TAKADA MASAHIRO (JP)
MATSUO SATOSHI (JP)
KOGA TAKAFUMI (JP)
MURAKAMI KOZO (JP)

International Classes:

H03H3/08; H03H9/25; H03H9/10; (IPC1-7): H03H3/08

Foreign References:

JPH02174412A	1990-07-05
JPH0897673A	1996-04-12
JPS5892117A	1983-06-01
JPS63178615A	1988-07-22
JPS5974719A	1984-04-27
JPH08307197A	1996-11-22
JPH08111629A	1996-04-30
JPH04275714A	1992-10-01

Other References: