Title:
SURFACE ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2006/092982
Kind Code:
A1
Abstract:
Disclosed is a surface acoustic wave device comprising a piezoelectric substrate, a comb-shaped electrode formed on a first major surface of the piezoelectric substrate, and a supporting substrate bonded to a second major surface of the piezoelectric substrate. The second major surface of the piezoelectric substrate and the supporting substrate are bonded with each other via a metal layer. Also disclosed is a method for manufacturing a surface acoustic wave device wherein a first metal layer is formed on a second major surface of a piezoelectric substrate and a second metal layer is formed on a major surface of a supporting substrate. The surfaces of the first metal layer and second metal layer are activated in a plasma, the first metal layer and the second metal layer are bonded with each other at room temperature, and a comb-shaped electrode is formed on a first major surface of the piezoelectric substrate.
Inventors:
TAKAYAMA RYOUICHI
MATSUI ATSUSHI
MATSUI ATSUSHI
Application Number:
PCT/JP2006/303023
Publication Date:
September 08, 2006
Filing Date:
February 21, 2006
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
TAKAYAMA RYOUICHI
MATSUI ATSUSHI
TAKAYAMA RYOUICHI
MATSUI ATSUSHI
International Classes:
H03H9/145; H03H3/08
Foreign References:
| JP2004343359A | 2004-12-02 | |||
| JP2003204244A | 2003-07-18 | |||
| JP2002135077A | 2002-05-10 | |||
| JP2000183676A | 2000-06-30 |
Attorney, Agent or Firm:
Iwahashi, Fumio c/o Matsushita Electric Industrial Co. Ltd. (1006, Oaza Kadom, Kadoma-shi Osaka 01, JP)
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