Title:
SURFACE ACOUSTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/100967
Kind Code:
A1
Abstract:
A surface acoustic wave device able to obtain an acoustic velocity higher than conventional surface acoustic wave devices, and able to not only minimize resistive loss by thickening the film thickness of electrodes, but also reduce propagation loss. In the surface acoustic wave device (1), IDT electrodes (3 to 5) having a plurality of finger electrodes (6, 7) are formed on top of a first main surface (2a) of a piezoelectric substrate (2), and a dielectric film (10) of a thickness thinner than the finger electrodes (6, 7) is formed in the gap between the finger electrode (6) and the finger electrode (7).
Inventors:
KIMURA TETSUYA (JP)
KADOTA MICHIO (JP)
HADA TAKUO (JP)
KADOTA MICHIO (JP)
HADA TAKUO (JP)
Application Number:
PCT/JP2010/050640
Publication Date:
September 10, 2010
Filing Date:
January 20, 2010
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
KIMURA TETSUYA (JP)
KADOTA MICHIO (JP)
HADA TAKUO (JP)
KIMURA TETSUYA (JP)
KADOTA MICHIO (JP)
HADA TAKUO (JP)
International Classes:
H03H9/145; H01L41/09; H01L41/18; H03H9/25
Foreign References:
| JPS5526724A | 1980-02-26 | |||
| JPS5647117A | 1981-04-28 | |||
| JPS57162819A | 1982-10-06 | |||
| JPH11186866A | 1999-07-09 | |||
| JP2002084156A | 2002-03-22 |
Attorney, Agent or Firm:
MIYAZAKI, CHIKARA (JP)
Miyazaki Chikara (JP)
Miyazaki Chikara (JP)
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