Title:
SURFACE ACOUSTIC WAVE ELEMENT PACKAGE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2018/093137
Kind Code:
A1
Abstract:
A surface acoustic wave element package according to the present invention includes: a surface acoustic wave element including a piezoelectric substrate, and including an IDT electrode and a plurality of electrodes formed on the piezoelectric substrate; a substrate for a package, the substrate for a package being provided with a plurality of terminals that respectively correspond to the plurality of electrodes, and having the surface acoustic wave element mounted thereon; and a cured nano-silver paste electrically connecting the plurality of electrodes to the plurality of terminals, respectively.
Inventors:
HA JONG-SOO (KR)
KIM JI-HO (KR)
KIM JI-HO (KR)
Application Number:
PCT/KR2017/012925
Publication Date:
May 24, 2018
Filing Date:
November 15, 2017
Export Citation:
Assignee:
WISOL CO LTD (KR)
International Classes:
H03H3/08; H03H9/10; H03H9/125; H03H9/25
Foreign References:
| KR20070012659A | 2007-01-26 | |||
| KR20140112158A | 2014-09-23 | |||
| US20100308696A1 | 2010-12-09 | |||
| KR20080008994A | 2008-01-24 | |||
| KR20060115791A | 2006-11-10 |
Attorney, Agent or Firm:
YOON, Jae Seung (KR)
Download PDF: