SURFACE ACOUSTIC WAVE FILTER AND MANUFACTURING METHOD THEREOF

Title:

SURFACE ACOUSTIC WAVE FILTER AND MANUFACTURING METHOD THEREOF

Document Type and Number:

WIPO Patent Application WO/2005/099090

Kind Code:

A1

Abstract:

A surface acoustic wave filter for preventing a large void from being generated at the time of pressing a resin sheet covering an element chip while heating the resin sheet, and a method for manufacturing the surface acoustic wave filter. The element chip (10) is arranged so as to have one main plane (11a) of a piezoelectric board (11) face a mounting board (2). On the piezoelectric board, a wiring pattern including an IDT (14) and a pad (16) electrically connected to the IDT (14) are formed. The pad (16) is electrically connected to a land (3) of the mounting board (2) through bumps (4). A resin film (6) covers the other main plane (11b) of the piezoelectric board (11) and the other main plane of the mounting board (2) and seals the element chip (10). The piezoelectric board (11) has the relatively large one main plane (11a) and the relatively small the other main plane (11b).

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Inventors:

TAKAMINE YUICHI (JP)

Application Number:

PCT/JP2005/006608

Publication Date:

October 20, 2005

Filing Date:

April 04, 2005

Export Citation:

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Assignee:

MURATA MANUFACTURING CO (JP)
TAKAMINE YUICHI (JP)

International Classes:

H03H3/08; H03H9/10; H03H9/25; H03H9/64; (IPC1-7): H03H9/25; H03H3/08; H03H9/64

Foreign References:

JP2003032061A	2003-01-31
JPS60176317A	1985-09-10
JPS5877921U	1983-05-26
JPS5541048A	1980-03-22
JP2003017979A	2003-01-17
JP2003032061A	2003-01-31
EP1061645A2	2000-12-20
JPS62257210A	1987-11-09

Other References: