Title:
SURFACE-CONDUCTIVE LAMINATED SHEET AND ELECTRONIC COMPONENT PACKAGING CONTAINER
Document Type and Number:
WIPO Patent Application WO/2018/084129
Kind Code:
A1
Abstract:
[Problem] To provide: a surface-conductive laminated sheet that exhibits superior strength and is capable of suppressing carrier tape crushing or deformation even when a pick-up nozzle contacts the carrier tape when mounting an electronic component; and an electronic component packaging container molded from said sheet, especially a carrier tape or electronic component conveyance tray. [Solution] The surface-conductive laminated sheet has a Martens hardness of 50–130 N/mm2, and is formed by laminating both sides of a sheet base layer made of a polystyrene resin having a conjugated diene content of 3.0–8.2% by mass with surface layers made of an electroconductive resin composition containing an electroconductive filler and a polystyrene resin having a conjugated diene content of 2.0–7.4% by mass.
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Inventors:
FUKUDA YUKO (JP)
MASUDA YUSUKE (JP)
MASUDA YUSUKE (JP)
Application Number:
PCT/JP2017/039258
Publication Date:
May 11, 2018
Filing Date:
October 31, 2017
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B32B27/30; B32B27/18; B65D65/40; B65D85/86
Domestic Patent References:
| WO2012102287A1 | 2012-08-02 | |||
| WO2012046815A1 | 2012-04-12 | |||
| WO2006030871A1 | 2006-03-23 |
Foreign References:
| JP2006231542A | 2006-09-07 | |||
| JP2006150729A | 2006-06-15 | |||
| JP2006212851A | 2006-08-17 | |||
| JP2004276479A | 2004-10-07 | |||
| JP2003073541A | 2003-03-12 | |||
| US20050250897A1 | 2005-11-10 |
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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