SURFACE GRINDING METHOD

WIPO Patent Application WO/2021/225020

A1

The present invention is a surface grinding method for a wafer, wherein: a wafer is prepared, the wafer having a first primary surface and a second primary surface on the side opposite the first primary surface, and having an edge part positioned between the first primary surface and the second primary surface; a release agent is applied to a portion of the second primary surface and to the edge part of the wafer to form a release agent layer; a resin layer covering the second primary surface and the entirety of the edge part is formed on the release agent layer; a base member is placed on the resin layer to obtain a wafer composite; the first primary surface of the wafer is ground in a state in which the wafer composite is supported and fixed at the position of the base member; the base member is removed from the wafer composite; the second primary surface of the wafer is ground in a state in which the wafer is supported and fixed at the position of the first primary surface; and the wafer is washed to remove the release agent layer and the resin layer remaining on the edge part of the wafer. Due to this configuration, a wafer surface grinding method is provided with which both surfaces of the wafer can be ground while preventing cracking of the wafer and preventing resin from remaining on the edge part.

JP7113456	Grinding device and grinding method
WO/2002/064334	GRITTED SAW BLADE

IGARASHI KENSAKU (JP)

PCT/JP2021/007004

November 11, 2021

February 25, 2021

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SHINETSU HANDOTAI KK (JP)

B24B7/00; B24B1/00; H01L21/304

JP2009148866A	2009-07-09
JP2019165152A	2019-09-26
JP2011216763A	2011-10-27
JP2019009372A	2019-01-17
JP2015038919A	2015-02-26
JP2006261370A	2006-09-28
US5622875A	1997-04-22

YOSHIMIYA Mikio et al. (JP)

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