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Title:
SURFACE METAL FILM MATERIAL, PROCESS FOR PRODUCING SURFACE METAL FILM MATERIAL, PROCESS FOR PRODUCING METAL PATTERN MATERIAL, AND METAL PATTERN MATERIAL
Document Type and Number:
WIPO Patent Application WO/2010/073903
Kind Code:
A1
Abstract:
Disclosed is a surface metal film material which comprises a base, a polymer layer for receiving a plating catalyst or a precursor thereof, and a metal film that is formed by plating, wherein the surface metal film, the polymer layer and the metal film are laminated in this order.  The surface metal film material meets requirements represented by the following formulae: x > y and 5 μm > x > 0.1 μm wherein x (μm) represents the surface roughness (Ra) of an interface between the base and the polymer layer and y (μm) represents the surface roughness (Ra) of an interface between the polymer layer and the metal film.

Inventors:
SATO, Masataka (577 Ushijima, Kaisei-machi, Ashigarakami-gu, Kanagawa 77, 〒2588577, JP)
Application Number:
JP2009/070543
Publication Date:
July 01, 2010
Filing Date:
December 08, 2009
Export Citation:
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Assignee:
FUJIFILM Corporation (26-30, Nishiazabu 2-chome Minato-k, Tokyo 20, 〒1068620, JP)
富士フイルム株式会社 (〒20 東京都港区西麻布2丁目26番30号 Tokyo, 〒1068620, JP)
International Classes:
B32B15/08; H05K3/38
Attorney, Agent or Firm:
NAKAJIMA, Jun et al. (TAIYO, NAKAJIMA & KATO Seventh Floor, HK-Shinjuku Bldg., 3-17, Shinjuku 4-chome, Shinjuku-k, Tokyo 22, 〒1600022, JP)
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