SURFACE MODIFICATION METHOD FOR RESIN BASE, METHOD FOR FORMING METAL COATING FILM, AND LAMINATE

WIPO Patent Application WO/2015/178101

A1

The present invention addresses the problem of providing: a surface modification method for a resin base, which is capable of forming an ultra fine metal wiring pattern that exhibits good adhesion to the surface of a resin base such as a polyester resin base, which contains a multiple bond in the main structure, without deteriorating the resin base; a method for forming a metal coating film; and a laminate which is formed by the surface modification method and the method for forming a metal coating film. In order to solve the above-mentioned problem, the present invention provides a surface modification method for a resin base, wherein the surface of a resin base is modified by irradiation of ultraviolet light before an electroless plating step. This surface modification method for a resin base is characterized in that: the resin base contains a multiple bond in a repeating unit of the main chain structure and has a visible light transmittance of 80% or more; and the surface of the resin base is modified within a depth of from 10 nm to 100 nm (inclusive) in an ozone-free atmosphere by irradiating the surface of the resin base with parallel ultraviolet light having a wavelength of from 200 nm to 320 nm (inclusive) so that the surface irradiance level thereof is from 1 J/cm2 to 20 J/cm2 (inclusive).

CORDONIER CHRISTOPHER (JP)
HONMA HIDEO (JP)

PCT/JP2015/059926

November 26, 2015

March 30, 2015

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KANTO GAKUIN SCHOOL CORP (JP)

C23C18/20; B32B15/08; C08J7/00

JPH08253869A	1996-10-01
JP2007231362A	2007-09-13
JP2009084596A	2009-04-23
JP2004186661A	2004-07-02
JP2000129449A	2000-05-09
JP2002522588A	2002-07-23

YOSHIMURA, KATSUHIRO (JP)
Katsuhiro Yoshimura (JP)

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