SURFACE MOUNT ELECTRIC PART - TYCO ELECTRONICS AMP KK

Title:

SURFACE MOUNT ELECTRIC PART

Document Type and Number:

WIPO Patent Application WO/2006/082699

Kind Code:

A1

Abstract:

A surface mounted electric part not requiring any additional facility investment on soldering and free from coming off a substrate even when the substrate is turned over and subjected to reflow. In a state that an electric part is placed under a circuit board (100), the sum B of the periphery length of a second soldering portion (P2) is so set that the relationship between a downward rotation moment (M1) around a first soldering portion (P1) produced by the gravity and an upward rotation moment (M2) acting on a second soldering portion (P2) produced by the surface tension of solder melted during soldering using the overall heating method is M1≤M2, and the sum A of the periphery length of the first soldering portion (P1) is so set that the relationship between a downward rotation moment (M3) around the second soldering portion (P2) produced by the gravity and an upward rotation moment (M4) acting on the first soldering portion (P1) produced by the surface tension is M3≤M4.

More Like This:

JP3260710	SURFACE MOUNT STRUCTURE OF MICROWAVE CIRCULATOR/ ISOLATOR
JPH0810216	[Name of invention] Mounting structure of chip parts
JP2746250	[Title of Invention] Crimping device

Inventors:

TSUJI JUNYA (JP)

Application Number:

PCT/JP2006/300317

Publication Date:

August 10, 2006

Filing Date:

January 06, 2006

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TYCO ELECTRONICS AMP KK (JP)
TSUJI JUNYA (JP)

International Classes:

H05K1/18; H05K3/34

Foreign References:

JPH05315738A	1993-11-26
JP2000357866A	2000-12-26
JP2003115334A	2003-04-18

Other References: