SURFACE MOUNTING MACHINE

WIPO Patent Application WO/2020/021657

A1

A surface mounting machine 1 for mounting a component E on a substrate P, is provided with: a correction unit 20 including a mounting head 25 that suctions the component E and mounts the component E on the substrate P, a substrate imaging camera 19 that images the substrate P, a correction mark 35 that is given on a base 34, a glass jig 36 through which light from the substrate imaging camera 19 is transmitted, and a moving unit 37 that moves the glass jig 36 between a position overlapping the correction mark 35 and a position not overlapping the correction mark 35; a position detection unit (computation processing unit 40) that detects a first position M1 of the correction mark 35 by imaging the correction mark 35 which is in a state of not overlapping the glass jig 36 by means of the substrate imaging camera 19, and detects a second position M2 of the correction mark 35 by imaging the correction mark 35 which is in a state of overlapping the glass jig 36 by means of the substrate imaging camera 19; and a correcting unit (computation processing unit 40) that corrects positional deviation of the component E on the basis of the difference between the first position M1 and the second position M2.

KISHIMOTO YOUHEI (JP)

PCT/JP2018/027903

January 30, 2020

July 25, 2018

Click for automatic bibliography generation  

YAMAHA MOTOR CO LTD (JP)

H05K13/08; H05K13/04

WO2014147701A1

2014-09-25

JP2008070135A	2008-03-27
JP2012146907A	2012-08-02
JP2017045913A	2017-03-02
JP2014041910A	2014-03-06

AKATSUKI UNION PATENT FIRM (JP)

View/Download PDF      PDF Help

Previous Patent: SEMICONDUCTOR CIRCUIT BREAKER AND CIRCUIT BREAKING DEVICE

Next Patent: LIGHT PROJECTION DEVICE AND LIGHT PROJECTION METHOD