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Patent Searching and Data


Title:
SURFACE MOUNTING TYPE ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2002/085082
Kind Code:
A1
Abstract:
A surface mounting type electronic component mounted by surface mounting on a printed circuit board in various types of electronic equipment, comprising a case (22) and a patchboard mounting part (51), the patchboard mounting part (51) further comprising a leg part (23) at the tip thereof bent parallel with the printed circuit board, an outer frame part (23A) soldered to the land part of the mounted part of the printed circuit board, and a projected part (23B) provided in the outer frame part and inserted into the hole part of the mounted part, whereby, even if an external force is applied to the electronic component from the outside, the mounted state thereof on the printed circuit board can be firmly maintained.

Inventors:
Yamasaki, Masato (8-1 Higashiichinomiya Tsuyama-shi, Okayama, Okayama, 708-0814, JP)
Ono, Koji (725-15, Katsube Tsuyama-shi, Okayama, 708-0804, JP)
Nishimoto, Takumi (557-27, Katsube Tsuyama-shi, Okayama, 708-0804, JP)
Sato, Jun (584-51, Nishiyoshida Tsuyama-shi, Okayama, 708-0856, JP)
Application Number:
PCT/JP2002/003464
Publication Date:
October 24, 2002
Filing Date:
April 05, 2002
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1006, Oaza Kadoma Kadoma-shi, Osaka, 571-8501, JP)
Yamasaki, Masato (8-1 Higashiichinomiya Tsuyama-shi, Okayama, Okayama, 708-0814, JP)
Ono, Koji (725-15, Katsube Tsuyama-shi, Okayama, 708-0804, JP)
Nishimoto, Takumi (557-27, Katsube Tsuyama-shi, Okayama, 708-0804, JP)
Sato, Jun (584-51, Nishiyoshida Tsuyama-shi, Okayama, 708-0856, JP)
International Classes:
H01C10/00; H01C1/144; H01G2/06; H05K1/18; H05K3/34; (IPC1-7): H05K1/18; H01C10/00; H01H9/02
Foreign References:
JPS5026735B1
JPS4933385U
JPS55166995A
JPH0449646A
Other References:
See also references of EP 1289353A1
Attorney, Agent or Firm:
Iwahashi, Fumio c/o Matsushita Electric Industrial Co. (Ltd. 1006 Oaza Kadoma Kadoma-shi, Osaka, 571-8501, JP)
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