Title:
SURFACE PROPERTY MEASURING DEVICE FOR POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2018/074041
Kind Code:
A1
Abstract:
This surface property measuring device for a polishing pad measures surface properties, such as surface shape and surface state, of a polishing pad to be used for the purpose of polishing substrates, such as a semiconductor wafer. The surface property measuring device is provided with: a housing (50) that does not pass light; an optical window (51) fitted in the housing (50); a laser light source (55) that emits laser light; an input light mirror (57) that guides the laser light to a polishing pad (1) via the optical window (51); and a light reception sensor (59) that measures the intensity of scattering light generated when the laser light hit the polishing pad (1). The laser light source (55), the input light mirror (57), and the light reception sensor (59) are disposed in the housing (50).
Inventors:
MATSUO HISANORI (JP)
KIMBA TOSHIFUMI (JP)
SUZUKI KEISUKE (JP)
SAKAMOTO KAZUHIRO (JP)
KIMBA TOSHIFUMI (JP)
SUZUKI KEISUKE (JP)
SAKAMOTO KAZUHIRO (JP)
Application Number:
PCT/JP2017/029154
Publication Date:
April 26, 2018
Filing Date:
August 10, 2017
Export Citation:
Assignee:
EBARA CORP (JP)
KYUSHU INST TECH (JP)
KYUSHU INST TECH (JP)
International Classes:
B24B49/12; B24B37/34; G01B11/30; H01L21/304
Domestic Patent References:
| WO2016111335A1 | 2016-07-14 |
Foreign References:
| JP2010120130A | 2010-06-03 | |||
| JP2002261059A | 2002-09-13 | |||
| JP2012135857A | 2012-07-19 | |||
| JP2001223190A | 2001-08-17 | |||
| JP2000271854A | 2000-10-03 | |||
| JP2013102223A | 2013-05-23 | |||
| JP2014172154A | 2014-09-22 | |||
| JP2015208840A | 2015-11-24 | |||
| JP2014132275A | 2014-07-17 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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