Title:
SURFACE-ROUGHENED COPPER FOIL AND COPPER-CLAD LAMINATED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2011/158825
Kind Code:
A1
Abstract:
Disclosed are a surface-roughened copper foil that can obtain excellent adhesion to an anisotropic conductive resin (ACF) and a copper-clad laminated substrate using same. Specifically disclosed is a surface-roughened copper foil which has been surface-roughened by surface roughening of at least one surface of a base copper foil (untreated copper foil), wherein the roughened surface has been finished to a surface roughness (Ra) of 0.28 µm or more of the adhesion surface of a polyimide film to be adhered to the roughened surface.
Inventors:
FUJISAWA SATOSHI (JP)
Application Number:
PCT/JP2011/063577
Publication Date:
December 22, 2011
Filing Date:
June 14, 2011
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
FUJISAWA SATOSHI (JP)
FUJISAWA SATOSHI (JP)
International Classes:
H05K1/09; H05K1/03
Domestic Patent References:
| WO2010061736A1 | 2010-06-03 |
Foreign References:
| JP2007036098A | 2007-02-08 | |||
| JP2007131909A | 2007-05-31 | |||
| JP2008118163A | 2008-05-22 | |||
| JP2009176897A | 2009-08-06 | |||
| JP2003251741A | 2003-09-09 | |||
| JPH06152087A | 1994-05-31 | |||
| JP2006147662A | 2006-06-08 | |||
| JP2009105286A | 2009-05-14 |
Attorney, Agent or Firm:
SATOH, TAKAHISA (JP)
Takahisa Sato (JP)
Takahisa Sato (JP)
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Claims: