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Title:
SURFACE SKIN MATERIAL
Document Type and Number:
WIPO Patent Application WO/2015/098032
Kind Code:
A1
Abstract:
A surface skin material having a porous heat insulation layer and a colored layer laminated, in order, on a leather base material. The porous heat insulation layer includes closed holes forming spheres having the upper side thereof squashed. The thickness of the porous heat insulation layer is 20-100 µm and proportion of the porous heat insulation layer occupied by the closed holes is 40%-90%.

Inventors:
MATSUDA KOKICHI (JP)
Application Number:
PCT/JP2014/006235
Publication Date:
July 02, 2015
Filing Date:
December 15, 2014
Export Citation:
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Assignee:
SEIREN CO LTD (JP)
International Classes:
B32B9/02; B32B5/18; C14C9/00
Domestic Patent References:
WO2012008336A12012-01-19
Foreign References:
JPS62135600A1987-06-18
JP2008265300A2008-11-06
JP2005220266A2005-08-18
EP0513408A11992-11-19
US20080066848A12008-03-20
JP2014012914A2014-01-23
Attorney, Agent or Firm:
TSUTADA, Masato et al. (JP)
Masato Tsutada (JP)
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