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Patent Searching and Data


Title:
SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE OBTAINED USING SURFACE-TREATED COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2014/126193
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a copper foil provided with better adhesiveness with an insulating resin substrate than that of a non-roughened copper foil, and provided with good etching performance equivalent to that of a non-roughened copper foil. In order to achieve said purpose, a surface-treated copper foil obtained by roughening a surface of the copper foil, or the like, is used, said surface-treated copper foil being characterized in that the surface of the copper foil is provided with a roughened surface roughened by needle-like or plate-like microscopic protrusions and recesses with a maximum length of 500 nm, said microscopic protrusions and recesses comprising a copper composite compound. The copper composite compound is preferably provided with a composition comprising 50% to 99% cuprous oxide, with the remainder comprising copper oxide and impurities.

Inventors:
TSUYOSHI HIROAKI (JP)
HOSOKAWA MAKOTO (JP)
Application Number:
PCT/JP2014/053450
Publication Date:
August 21, 2014
Filing Date:
February 14, 2014
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C23C26/00; B32B15/08; H05K1/09
Foreign References:
JPS56153797A1981-11-27
JP2008248269A2008-10-16
JPH0533193A1993-02-09
JP2006152329A2006-06-15
Attorney, Agent or Firm:
YOSHIMURA, KATSUHIRO (JP)
Katsuhiro Yoshimura (JP)
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