Title:
SURFACE-TREATED COPPER FOIL AND COPPER-CLAD LAMINATE PRODUCED USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/138338
Kind Code:
A1
Abstract:
The present invention provides: a surface-treated copper foil which achieves a balance at a high level between reflow heat resistance and transmission characteristics, while ensuring sufficient adhesion to an insulating substrate; and the like. A surface-treated copper foil according to the present invention is obtained by providing a surface roughening layer (120) on a copper foil base (110), and is characterized in that: the surface roughening layer (120) has a recessed and projected surface that is formed of roughening particles; in a cross-section that is perpendicular to the copper foil base surface, the ratio of the creepage distance (Da) measured along the recessed and projected surface of the surface roughening layer (120) relative to the creepage distance (Db) measured along the copper foil base surface, namely Da/Db is within the range of 1.05-4.00; the average height difference H between recesses and projections in the recessed and projected surface is within the range of 0.2-1.3 μm; and a silane coupling agent layer having a silane coating amount of 0.0003-0.0300 mg/dm2 is formed on the surface roughening layer (120) directly or with an intermediate layer being interposed therebetween.
Inventors:
SATO AKIRA (JP)
UNO TAKEO (JP)
UNO TAKEO (JP)
Application Number:
PCT/JP2017/002145
Publication Date:
August 17, 2017
Filing Date:
January 23, 2017
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C25D7/06; B32B3/30; B32B15/20; C23C26/00; C25D5/16; H05K1/09
Domestic Patent References:
| WO2011090175A1 | 2011-07-28 | |||
| WO2006134868A1 | 2006-12-21 |
Foreign References:
| JP2011219790A | 2011-11-04 | |||
| JP2007332418A | 2007-12-27 |
Attorney, Agent or Firm:
MORI Tetsuya et al. (JP)
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