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Patent Searching and Data


Title:
SURFACE TREATED COPPER FOIL AND COPPER-CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO/2018/110579
Kind Code:
A1
Abstract:
A surface treated copper foil having laminated, in order, upon at least one surface of the copper foil, a roughening layer, an antitrust treatment layer, and a silane coupling layer. The surface treated copper foil has a developed area ratio Sdr value for the interface of 8%–140%, said developed area ratio being a composite parameter of three-dimensional surface properties measured from the surface of the silane coupling layer.

Inventors:
SHINOZAKI KENSAKU (JP)
OKUNO YUKO (JP)
UNO TAKEO (JP)
Application Number:
PCT/JP2017/044647
Publication Date:
June 21, 2018
Filing Date:
December 13, 2017
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C25D7/06; C25D1/04; C25D5/12; C25D5/16; C25D5/48; H05K1/09
Foreign References:
JP2015105421A2015-06-08
JP2015061934A2015-04-02
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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