Title:
SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/181726
Kind Code:
A1
Abstract:
This surface-treated copper foil (11) has, at least on one surface of a copper foil substrate, a surface-treatment film including at least a roughened surface on which roughening particles (111) are formed. When a cross-section of the surface-treated copper foil (11) is observed with a scanning electron microscope, the particle height of roughening particles (111) on the surface of the surface-treatment film have a standard deviation of 0.16 µm to 0.30 µm inclusive, and the average value of the ratio (particle height/particle width) of the height to width of the roughening particles (111) is 2.30 to 4.00 inclusive.
Inventors:
UNO TAKEO (JP)
OKUNO YUKO (JP)
TSURUTA TAKAHIRO (JP)
NISHI YOSHIMASA (JP)
FUKUTAKE SUNAO (JP)
OKUNO YUKO (JP)
TSURUTA TAKAHIRO (JP)
NISHI YOSHIMASA (JP)
FUKUTAKE SUNAO (JP)
Application Number:
PCT/JP2018/013279
Publication Date:
October 04, 2018
Filing Date:
March 29, 2018
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
MURATA MANUFACTURING CO (JP)
MURATA MANUFACTURING CO (JP)
International Classes:
C25D7/06; B32B15/08; C25D1/04; C25D5/16; H05K1/03
Domestic Patent References:
| WO2016117587A1 | 2016-07-28 | |||
| WO2017026490A1 | 2017-02-16 | |||
| WO2016035876A1 | 2016-03-10 | |||
| WO2014196576A1 | 2014-12-11 |
Foreign References:
| JP2015147978A | 2015-08-20 |
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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