Title:
SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE SHEET AND PRINTED WIRING BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/021895
Kind Code:
A1
Abstract:
The present invention provides a surface-treated copper foil and the like, capable of achieving both excellent high-frequency characteristics and high adhesiveness. The surface-treated copper foil has a copper foil substrate and a surface-treated film including at least a roughened layer formed by the formation of roughening particles at least on one surface of the copper foil substrate. The surface-treated copper foil is characterized in that when the number of roughening particles having a long-side dimension t1 of 0.1 µm or larger is counted in an analysis region where a surface of the surface-treated film is observed with a scanning electron microscope (SEM), the number ratio of roughening particles having a long-side dimension t1 of 3.0 µm or less is 99.0% or higher, the number ratio of roughening particles having a long-side dimension t1 of 1.0-3.0 µm within the aforementioned number ratio is 2.0-20.0%, and the number ratio of roughening particles having a ratio (t1/t2), that is, a ratio of long-side dimension t1 to short-side dimension t2, of 2 or larger among the roughening particles having the long-side dimension t1 of 1.0-3.0 µm is 20% or higher.
Inventors:
SAITO TAKAHIRO (JP)
Application Number:
PCT/JP2018/026793
Publication Date:
January 31, 2019
Filing Date:
July 18, 2018
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C25D7/06; C25D3/38; C25D5/16; C25D7/00; H05K3/38
Domestic Patent References:
| WO2014196576A1 | 2014-12-11 | |||
| WO2012043182A1 | 2012-04-05 | |||
| WO2016035876A1 | 2016-03-10 |
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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