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Title:
SURFACE-TREATED COPPER FOIL, COPPER CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/208522
Kind Code:
A1
Abstract:
The surface-treated copper foil 1 has a copper foil 2 and a first surface-treated layer 3 formed on one surface of the copper foil 2. The first surface-treated layer 3 of this surface-treated copper foil 1 has an L* value of 44.0 to 84.0 in the CIE L*a*b* color system. In addition, the copper-clad laminate 10 is provided with the surface-treated copper foil 1 and an insulating base material 11 adhered to the opposite surface of the surface-treated copper foil 1 from the first surface-treated layer 3.

Inventors:
MIYAMOTO,Nobuaki (JX Nippon Mining & Metals Corporation3-1,Shirogane-cho 3-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
MIKI,Atsushi (JX Nippon Mining & Metals Corporation3-1,Shirogane-cho 3-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
Application Number:
JP2019/017093
Publication Date:
October 31, 2019
Filing Date:
April 22, 2019
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORPORATION (1-2Otemachi 1-chome, Chiyoda-ku Tokyo, 64, 〒1008164, JP)
International Classes:
C25D7/06; B32B15/08; C25D5/12; H05K1/09
Domestic Patent References:
WO2016038923A12016-03-17
WO2010074053A12010-07-01
WO2010074061A12010-07-01
WO2010074072A12010-07-01
Foreign References:
JP2016010961A2016-01-21
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (Shimbashi i-mark Bldg, 6-2 Shimbashi 2-Chome Minato-k, Tokyo 04, 〒1050004, JP)
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