Title:
SURFACE-TREATED COPPER FOIL, COPPER CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/208525
Kind Code:
A1
Abstract:
The surface-treated copper foil 1 has a copper foil 2 and a first surface-treated layer 3 formed on one surface of the copper foil 2. The root-mean-square slope R∆q of a roughness curve element of the first surface-treated layer 3 of this surface-treated copper foil 1 as measured based on JIS B0601: 2013 is 5-28°. In addition, the copper-clad laminate 10 is provided with the surface-treated copper foil 1 and an insulating base material 11 adhered to the first surface-treated layer 3 of the surface-treated copper foil 1.
Inventors:
MIYAMOTO NOBUAKI (JP)
MIKI ATSUSHI (JP)
MIKI ATSUSHI (JP)
Application Number:
PCT/JP2019/017096
Publication Date:
October 31, 2019
Filing Date:
April 22, 2019
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D7/06; B32B15/08; C25D5/12; C25D5/16; H05K1/09
Domestic Patent References:
| WO2016035604A1 | 2016-03-10 | |||
| WO2017006739A1 | 2017-01-12 |
Foreign References:
| JP5204908B1 | 2013-06-05 | |||
| JP2849059B2 | 1999-01-20 |
Other References:
See also references of EP 3786318A4
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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