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Patent Searching and Data


Title:
SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND CIRCUIT SUBSTRATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2020/066796
Kind Code:
A1
Abstract:
Provided is a surface-treated copper foil provided with excellent laser workability. A surface-treated copper foil in which the surface thereof is subjected to a roughening treatment to form a roughened surface, wherein the surface skewness Ssk of the roughened surface measured using an instrument for measuring three-dimensional roughness is in the range of -0.300 to less than 0, and the arithmetic mean peak curvature Ssc is in the range of 0.0220 nm-1 to less than 0.0300 nm-1.

Inventors:
TSURUTA TAKAHIRO (JP)
UNO TAKEO (JP)
OKUNO YUKO (JP)
FUKUTAKE SUNAO (JP)
NISHI YOSHIMASA (JP)
Application Number:
JP2019/036596
Publication Date:
April 02, 2020
Filing Date:
September 18, 2019
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
MURATA MANUFACTURING CO (JP)
International Classes:
C25D5/16; C25D3/38; C25D7/06; H05K1/03; H05K1/09
Foreign References:
JP2004119961A2004-04-15
JP2014194067A2014-10-09
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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