Title:
SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/281759
Kind Code:
A1
Abstract:
This surface-treated copper foil has a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The surface-treated layer has an Sku of 2.50-4.50 and an Str of 0.20-0.40.
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Inventors:
MATSUOKA YUKI (JP)
IWASAWA SHOHEI (JP)
GOTO IKUHIRO (JP)
NAKASHIMA SEIYA (JP)
MIKI ATSUSHI (JP)
IWASAWA SHOHEI (JP)
GOTO IKUHIRO (JP)
NAKASHIMA SEIYA (JP)
MIKI ATSUSHI (JP)
Application Number:
PCT/JP2021/026044
Publication Date:
January 12, 2023
Filing Date:
July 09, 2021
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D3/38; C23C28/00; C25D3/58; C25D5/16; C25D7/06
Domestic Patent References:
| WO2010110092A1 | 2010-09-30 | |||
| WO2018110579A1 | 2018-06-21 | |||
| WO2014081041A1 | 2014-05-30 | |||
| WO2013047272A1 | 2013-04-04 | |||
| WO2018207786A1 | 2018-11-15 | |||
| WO2021157362A1 | 2021-08-12 |
Foreign References:
| JPH06169169A | 1994-06-14 | |||
| JP2014139336A | 2014-07-31 | |||
| JP2014506202A | 2014-03-13 | |||
| JP2021085095A | 2021-06-03 |
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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